Automatic Backside Etching Equipment
Xtrim-SC-BC300
Xtrim-SC-BE300
Equipment Overview
Loadport*2、Chamber*2、Bernoulli Robot、Bernoulli Chuck
Customizable
Supports wafer from 6” to 12”
Supports THK: 100 - 775um
Supports Taiko wafer and Glass wafer
Automation
Robotic wafer handling
Automatic make up and dosing system
Contactless Transfer & Etching Process
Contactless wafer transfer via Bernoulli robotic arm
Bernoulli chuck protects wafers from chemical splashing
Superior Process Performance
- Particle ＜ 30ea @ 0.16um
- Metal: 1E8 atoms/cm2 •WIW/WTW ＜ 3%