Post-Cleaning Mechanical Polishling Equipment
Xtrim-SC-BC300
Equipment Overview
LD/ULD 、Brush Chamber、Clean Chamber、Transfer Module、Robot、Chemical CDS
Comprehensive Functions
Supports double-sided brushing and edge brushing, with quick brush replacement.
Optional basic configurations: Mega-Sonic, DIW, N₂, etc.
Automated Production
Supports interconnection with CMP equipment / offline sink loading.
Robot automatic wafer loading and unloading.
Supports automatic chemical mixing and liquid supply.
Customized Design
Supports 6", 8" and 12-inch wafers.
Customized matching is available according to customer requirements.
Contamination Control
Professional material selection: achieving efficient particle control.
Wafers are transported in a closed-environment modular manner between chambers.