FOUP/FOSB Inspection System
Xtrim-FI-300
Equipment Overview
Support the complete localization of all components and parts；LD/ULD ;Robot;3D measure；FFU
3D Inspection
3D Multi-Directional Measurement，Z49，Z47，X46，Y52，Y46，R1，Wafer Plane Height，SEMI Standard-specified items (X30, X31, Z30, Z31, etc.)
Automatic Calibration
Equipped with an automatic calibration function, which ensures the accuracy of each measurement.
High Precision & Consistency: Accuracy up to ±25μm, Repeatability of Multiple Inspections: ±15μm
Low Cost of Ownership (COO)
The smallest size in the industry
Field/Product
Substrate Manufacturing, Wafer Manufacturing, Advanced Packaging/FOUP、FOSB