
Complete a cleaning cycle within 30-60 minutes, ensuring products enter and exist in a dry state
Provides excellent particle control
Hot air/Infrared drying
Supports FOUP for wafers from 4” to 12”
Supports FOUP, FOSB, mask package, cassette, box, etc
DBPS dynamic balance protection
Foolproof protection system
High temperature interlock control
SEMI S2 F47 Certificated