
Fully automated process, including lid opening/closing, wafer inspection, cleaning, drying, vacuuming, and dehumidification
Supports various FOUP/FOSB types without hardware modifications
Particle、AMC(including VOC)、Outgassing controlling
N2 Purge maintains optimal humidity inside the FOUP
Capable of cleaning 25-30 FOUP/ FOSB per hour
SEMI S2 F47 Certificated