JSXM TSV Advanced Packaging R&D Center
The JSXM TSV Advanced Packaging R&D Center is located in Room 401, Building 1, Zhongwu Runjin Industrial Park. This facility is dedicated to the development of electrochemical deposition equipment for Through-Silicon Via (TSV) applications, forming a comprehensive R&D and prototyping platform for advanced packaging technologies. With a focus on solving critical bottlenecks in vertical interconnects—particularly in 2.5D and 3D packaging—the center aims to become the second domestic company to master and industrialize this key process, contributing to the localization of advanced semiconductor equipment.
Occupying approximately 1,500 m², the center has both Class 1,000 and Class 100 cleanroom environments. It is equipped with JSXM’s in-house developed horizontal electrochemical deposition equipment, alongside coating, exposure, development, and etching equipment supporting the complete TSV, bumping, and RDL process flows. The facility also includes equipment for wafer FOUP/Cassette cleaning, single-wafer cleaning, brushing, etching, photoresist removal, and backside etching—offering robust capabilities for in-house innovation and customer sample testing.